| 1 | Profile A | Microcontrollers, embedded control ICs, mixed-signal devices | Industrial automation, home appliances, automotive electronics | 180–40 nm | 8-inch / 12-inch | QFN, QFP, BGA, wafer-level packages | High-volume mature-node production and local design support | Strong demand from consumer, industrial, and automotive supply chains |
| 2 | Profile B | Power management ICs, battery-management ICs, charging ICs | Mobile devices, energy storage, electric vehicles, power supplies | 350–55 nm | 8-inch / 12-inch | QFN, DFN, TSSOP, wafer-level packages | Broad analog portfolio and high-efficiency power architectures | Rapid expansion supported by electrification and renewable-energy demand |
| 3 | Profile C | Display driver ICs, touch controllers, interface ICs | Smartphones, tablets, monitors, televisions, automotive displays | 180–65 nm | 8-inch / 12-inch | COF, COG, QFN, wafer-level packages | High-volume integration of display, touch, and connectivity functions | Large domestic electronics ecosystem with significant export exposure |
| 4 | Profile D | Analog signal-chain ICs, amplifiers, data converters | Test equipment, communications, medical electronics, industrial control | 180–40 nm | 8-inch / 12-inch | SOIC, TSSOP, QFN, BGA | Precision, low-noise, and high-reliability analog design | Supported by industrial upgrading and demand for domestic components |
| 5 | Profile E | Discrete power devices, gate drivers, automotive power ICs | Electric vehicles, chargers, photovoltaic systems, industrial drives | 0.35 μm–90 nm | 6-inch / 8-inch | TO, DPAK, DFN, QFN, power modules | High-voltage operation, thermal management, and automotive qualification | One of the fastest-growing application areas due to energy transition |
| 6 | Profile F | Connectivity ICs, radio-frequency front-end ICs, sensor interfaces | Wireless equipment, smart devices, Internet of Things, industrial sensing | 180–55 nm | 8-inch / 12-inch | QFN, WLCSP, BGA, flip-chip packages | Integration of analog, digital, and radio-frequency functions | Expanding with smart manufacturing, connected vehicles, and IoT deployment |
| 7 | Profile G | Security ICs, secure elements, identification and authentication ICs | Financial services, identity systems, transportation, connected devices | 180–40 nm | 6-inch / 8-inch | Contact, contactless, QFN, embedded packages | Hardware security, encryption, tamper resistance, and secure provisioning | Stable domestic demand driven by digital payments and trusted computing |
| 8 | Profile H | Memory control ICs, EEPROM, NOR and specialty memory devices | Consumer electronics, automotive systems, industrial equipment | 180–40 nm | 8-inch / 12-inch | TSOP, BGA, WSON, wafer-level packages | Non-volatile memory reliability and long-life-cycle products | Strategic market with opportunities in automotive and industrial substitution |
| 9 | Profile I | Automotive sensing ICs, motor-control ICs, interface controllers | Electric vehicles, intelligent transportation, battery systems, chassis electronics | 350–55 nm | 8-inch / 12-inch | QFN, SOIC, automotive-grade QFP, power packages | Automotive-grade reliability, temperature tolerance, and functional safety | High-growth segment supported by vehicle electrification and intelligence |
| 10 | Profile J | Optical sensing ICs, image-signal interfaces, environmental sensors | Wearables, smart appliances, medical devices, industrial monitoring | 180–65 nm | 6-inch / 8-inch | QFN, LGA, BGA, chip-scale packages | Low-power sensing, compact integration, and application-specific design | Emerging scope across healthcare, smart homes, and industrial IoT |