| Fiber laser | Commonly around 1,064–1,080 nm | Marking, engraving, and cutting many metals; some systems are configured for plastics or other materials. | Efficient, compact systems can deliver precise processing and generally require little routine optical-path maintenance. | Standard near-infrared fiber lasers are not suitable for every material. They can be a poor choice for clear glass and some transparent or highly reflective work without the right system and process. | Confirm the material and operation, required power, work area, pulse settings, extraction needs, and whether an enclosed system is required. |
| CO₂ laser | Commonly 10.6 μm; some systems use other CO₂ wavelengths | Cutting and engraving wood, acrylic, paper, textiles, and other non-metallic materials. | Well suited to many non-metallic sheet materials and can provide a useful balance of cutting and engraving capability. | Most standard CO₂ systems do not directly cut bare metals effectively. Optics and laser tubes can need periodic alignment, cleaning, or replacement. | Check the materials list, usable bed size, exhaust and cooling requirements, expected maintenance, and whether metal processing is actually supported. |
| Diode laser | Often visible blue light around 445–455 nm; infrared models are also available | Entry-level engraving and light-duty cutting of selected woods, paper, leather, and coated materials. | Often offers a lower-cost, compact entry point for small workshops and hobby projects. | Cutting speed and material range are generally more limited than those of higher-power industrial systems. Some clear or reflective materials are difficult to process. | Verify optical output power separately from electrical input power, the actual work area, supported materials, enclosure, and filtration or exhaust provisions. |
| UV laser | Commonly 355 nm | Fine marking and micromachining on selected plastics, glass, electronics, and other heat-sensitive materials. | Short-wavelength processing can create small, detailed marks with limited heat-affected areas in suitable applications. | Usually a specialized, higher-cost option; performance depends strongly on the material, surface, and process settings. | Request sample tests using the exact material and finish. Check pulse characteristics, precision, maintenance, guarding, and service support. |
| Nd:YAG or other solid-state laser | Commonly 1,064 nm; frequency-converted versions can operate at shorter wavelengths | Metal marking, engraving, and selected industrial processing; pulsed configurations are used for applications such as spot welding. | Available in configurations suited to pulsed marking and other focused industrial tasks. | Capabilities vary substantially by laser source and configuration. The purchase may require more specialized setup and process knowledge. | Compare pulse energy, repetition rate, beam quality, cooling needs, enclosure, and compatibility with the intended production cycle. |
| Excimer laser | Ultraviolet wavelengths, commonly including 193, 248, and 308 nm | Specialized ultraviolet processing, including selected semiconductor, scientific, and medical manufacturing applications. | Can support precise UV material processing in applications that require specific wavelengths and process control. | Typically intended for specialized industrial or research settings rather than general-purpose workshop cutting or engraving. | Confirm wavelength-specific process results, facility requirements, consumables, maintenance arrangements, and operator training. |